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(R) CMOS STATIC RAMs 64K (16K x 4-BIT) Added Chip Select and Output Controls IDT7198S IDT7198L Integrated Device Technology, Inc. FEATURES: * Fast Output Enable (OE) pin available for added system flexibility * Multiple Chip Selects (CS1, CS2) simplify system design and operation * High speed (equal access and cycle times) -- Military: 20/25/35/45/55/70/85ns (max.) * Low power consumption * Battery back-up operation--2V data retention (L version only) * 24-pin CERDIP, high-density 28-pin leadless chip carrier, and 24-pin CERPACK packaging available * Produced with advanced CMOS technology * Bidirectional data inputs and outputs * Inputs/outputs TTL-compatible * Military product compliant to MIL-STD-883, Class B DESCRIPTION: The IDT7198 is a 65,536 bit high-speed static RAM orga- nized as 16K x 4. It is fabricated using IDT's high-performance, high-reliability technology--CMOS. This state-of-theart technology, combined with innovative circuit design techniques, provides a cost effective approach for memory intensive applications. Access times as fast as 20ns are available. The IDT7198 offers a reduced power standby mode, ISB1, which is activated when CS1 or CS2 goes HIGH. This capability decreases power, while enhancing system reliability. The low-power version (L) also offers a battery backup data retention capability where the circuit typically consumes only 30W when operating from a 2V battery. All inputs and outputs are TTL-compatible and operate from a single 5V supply. The lDT7198 is packaged in either a 24-pin ceramic DlP, 28-pin leadless chip carrier, and 24-pin CERPACK. Military grade product is manufactured in compliance with the latest revision of MIL-STD-883, Class B, making it ideally suited to military temperature applications demanding the highest level of performance and reliability. FUNCTIONAL BLOCK DIAGRAM A0 VCC GND DECODER 65,536-BIT MEMORY ARRAY A13 I/O0 I/O1 I/O2 I/O3 COLUMN I/O INPUT DATA CONTROL CS1 CS2 WE1 OE 2985 drw 01 The IDT logo is a registered trademark of Integrated Device Technology, Inc. MILITARY TEMPERATURE RANGE (c)1994 Integrated Device Technology, Inc. MAY 1994 6.4 DSC-1027/4 1 IDT7198S/L CMOS STATIC RAM 64K (16K x 4-BIT) Added Chip Select and Output Enable Controls MILITARY TEMPERATURE RANGE MEMORY CONTROL The IDT7198 64K high-speed CMOS static RAM incorporates two additional memory control features (an extra chip select and an output enable pin) which offer additional benefits in many system memory applications. Both chip selects, Chip Select 1 (CS1) and Chip Select 2 (CS2), must be LOW to select the memory. If either chip select is pulled HIGH, the memory will be deselected and remain in the standby mode. This dual chip select feature (CS1, CS2) also brings the convenience of improved system speeds to the large memory designer by reducing the external logic required to perform decoding. PIN DESCRIPTIONS Name A0-A13 CS1 CS2 WE OE Description Address Inputs Chip Select 1 Chip Select 2 Write Enable Output Enable Data I/O Power Ground 2985 tbl 01 I/O0-I/O3 VCC GND PIN CONFIGURATIONS A0 A1 A2 A3 A4 A5 A6 A7 A8 CS 1 OE TRUTH TABLE(1) Mode CS1 CS CS2 WE OE I/O High-Z High-Z DOUT DIN High-Z Power Standby Standby Active Active Active 2985 tbl 02 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 D24-1 E24-1 19 18 17 16 15 16 15 VCC A13 A12 A11 A10 A9 CS2 Standby Standby Read Write Read H X L L L X H L L L X X H L H X X L X H I/O3 I/O2 I/O1 I/O0 WE NOTE: 1. H = VIH, L = VIL, X = don't care. GND 2985 drw 02 DIP/SOJ/CERPACK TOP VIEW ABSOLUTE MAXIMUM RATINGS(1) Symbol VTERM TA Rating Terminal Voltage with Respect to GND Operating Temperature Temperature Under Bias Storage Temperature Power Dissipation DC Output Current Mil. -0.5 to +7.0 -55 to +125 -65 to +135 -65 to +150 1.0 50 Unit V C C C W mA INDEX A0 NC NC VCC NC TBIAS TSTG 3 2 A1 A2 A3 A4 A5 A6 A7 A8 CS 1 4 5 6 7 8 9 10 11 1 28 27 26 25 24 23 L28-2 22 21 20 19 18 12 13 14 15 16 17 NC A13 A12 A11 A10 A9 I/O3 I/O2 I/O1 2985 drw 03 PT IOUT NOTE: 2985 tbl 03 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. OE GND CS 2 WE I/O 0 LCC TOP VIEW 6.4 2 IDT7198S/L CMOS STATIC RAMS 64K (16K x 4-BIT) Added Chip Select and Output Enable Controls MILITARY TEMPERATURE RANGE RECOMMENDED DC OPERATING CONDITIONS Symbol VCC GND VIH VIL Parameter Supply Voltage Supply Voltage Input High Voltage Input Low Voltage Min. 4.5 0 2.2 -0.5(1) Typ. 5.0 0 -- -- Max. Unit 5.5 0 6.0 0.8 V V V V RECOMMENDED OPERATING TEMPERATURE AND SUPPLY VOLTAGE Grade Military Ambient Temperature -55C to +125C GND 0V VCC 5V 10% 2985 tbl 06 CAPACITANCE (TA = +25C, f = 1.0MHz, VCC = 0V) Symbol CIN CI/O Parameter(1) Input Capacitance I/O Capacitance Conditions VIN = 0V VOUT = 0V Max. 7 7 Unit pF pF NOTE: 2985 tbl 05 1. VIL (min.) = -3.0V for pulse width less than 20ns, once per cycle. NOTE: 2985 tbl 04 1. This parameter is determined by device characterization, but is not production tested. DC ELECTRICAL CHARACTERISTICS VCC = 5.0V 10%, Military Temperature Range Only IDT7198S Symbol |ILI| |ILO| VOL Parameter Input Leakage Current Output Leakage Current Output Low Voltage Test Condition VCC = Max., VIN = GND to VCC VCC = Max., CS = VIH, VOUT = GND to VCC IOL = 10mA, VCC = Min. IOL = 8mA, VCC = Min. VOH Output High Voltage IOH = -4mA, VCC = Min. -- 2.4 Min. -- -- Max. 10 10 0.5 0.4 -- IDT7198L Min. -- -- -- -- 2.4 Max. 5 5 0.5 0.4 -- V 2985 tbl 07 Unit A A V AC TEST CONDITIONS Input Pulse Levels Input Rise/Fall Times Input Timing Reference Levels Output Reference Levels AC Test Load GND to 3.0V 5ns 1.5V 1.5V See Figures 1 and 2 2985 tbl 10 5V 480 DATAOUT 255 30pF* 5V 480 DATAOUT 255 5pF* 2985 drw 05 2985 drw 06 Figure 1. AC Test Load Figure 2. AC Test Load (for tCLZ1, 2, tOLZ, tCHZ1, 2, tOHZ, tOW and tWHZ) *Includes scope and jig capacitances 6.4 3 IDT7198S/L CMOS STATIC RAM 64K (16K x 4-BIT) Added Chip Select and Output Enable Controls MILITARY TEMPERATURE RANGE DC ELECTRICAL CHARACTERISTICS(1) (VCC = 5V 10%, VLC = 0.2V, VHC = VCC - 0.2V) 7198S20 7198L20 Symbol ICC1 Parameter Operating Power Supply Current, CS1 and CS2 VIL, Outputs Open VCC = Max., f = 0(2) Dynamic Operating Current, CS1 and CS2 VIL, Outputs Open VCC = Max., f = fMAX(2) Standby Power Supply Current (TTL Level), CS1 or CS2 VIH, VCC = Max., Outputs Open, f = fMAX(2) Full Standby Power Supply Current (CMOS Level) CS1 or CS2 VHC, VCC= Max., VIN VHC or VIN VLC, f = 0(2) Power S L S L S L S Military 105 80 160 130 70 50 25 7198S25 7198L25 Military 105 80 155 120 60 40 20 7198S35 7198L35 Military 105 80 140 115 50 35 20 7198S45 7198S55/70 7198S85 7198L45 7198L55/70 7198L85 Military 105 80 140 110 50 35 20 Military 105 80 140 110 50 35 20 Military 105 80 140 105 50 35 20 mA mA mA Unit mA ICC2 ISB ISB1 L 1.5 1.5 1.5 1.5 1.5 1.5 2985 tbl 06 NOTES: 1. All values are maximum guaranteed values. 2. At f = fMAX address and data inputs are cycling at the maximum frequency of read cycles of 1/tRC. f = 0 means no input lines change. DATA RETENTION CHARACTERISTICS OVER MILITARY TEMPERATURE RANGE (L Version Only) VLC = 0.2V, VHC = VCC - 0.2V Typ. (1) VCC @ Symbol VDR ICCDR tCDR(3) tR(3) |ILI| (3) Max. VCC @ 2.0V -- 600 -- -- 2 3.0V -- 900 -- -- 2 Unit V A ns ns A 2985 tbl 09 Parameter VCC for Data Retention Data Retention Current Chip Deselect to Data Retention Time Operation Recovery Time Input Leakage Current Test Condition -- CS1 Min. 2.0 -- 0 tRC(2) -- 2.0v -- 10 -- -- -- 3.0V -- 15 -- -- -- or CS2 VHC VIN VHC or VLC NOTES: 1. TA = +25C. 2. tRC = Read Cycle Time. 3. This parameter is guaranteed by device characterization but is not production tested. LOW VCC DATA RETENTION WAVEFORM DATA RETENTION MODE VDR2V VIH VDR VIH 2985 drw 04 VCC t CDR CS 4.5V 4.5V tR 6.4 4 IDT7198S/L CMOS STATIC RAMS 64K (16K x 4-BIT) Added Chip Select and Output Enable Controls MILITARY TEMPERATURE RANGE AC ELECTRICAL CHARACTERISTICS (VCC = 5.0V 10%, Military Temperature Range) 7198S20 7198L20 Symbol Read Cycle tRC tAA tACS1,2 tCLZ1,2 tOE tOLZ (2) (2) (1) (2) 7198S25 7198L25 7198S35/45 7198L35/45 7198S55 7198L55 7198S70 7198L70 7198S85 7198L85 Parameter Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Unit Read Cycle Time Address Access Time Chip Select-1,2 Access Time Chip Select-1,2 to Output in Low-Z Output Enable to Output Valid Output Enable to Output in Low-Z Chip Select 1,2 to Output in High-Z Output Disable to Output in High-Z Output Hold from Address Change Chip Select to Power Up Time Chip Deselect to Power Down Time 20 -- -- 5 -- 5 -- -- 5 0 -- -- 19 20 -- 9 -- 8 8 -- -- 20 25 -- -- 5 -- 5 -- -- 5 0 -- -- 25 25 -- 11 -- 10 9 -- -- 25 35/45 -- -- 5 -- 5 -- -- 5 0 -- -- 55 -- 55 55 -- 35 -- 20 20 -- -- 55 70 -- -- 5 -- 5 -- -- 5 0 -- -- 70 70 -- 45 -- 25 25 -- -- 70 85 -- -- 5 -- 5 -- -- 5 0 -- -- 85 85 -- 55 -- 30 30 -- -- 85 ns ns ns ns ns ns ns ns ns ns ns 2985 tbl 11 35/45 -- 35/45 -- -- 5 20/25 -- -- 14 15 -- -- 5 -- -- 5 0 tCHZ1,2 tOHZ tOH tPU tPD (2) (2) (2) 35/45 -- NOTES: 1. Both chip selects must be active low for the device to be selected. 2. This parameter is guaranteed by device characterization but is not production tested. TIMING WAVEFORM OF READ CYCLE NO. 1(1) tRC ADDRESS tAA OE tOH tOE tOLZ CS1, (5) tOHZ (5) 2 tACS1, 2 tCLZ1, 2 DATAOUT (5) tCHZ1, 2 DATA VALID (5) 2985 drw 07 NOTES: 1. WE is HIGH for Read cycle. 2. Device is continuously selected, CS1 is LOW, CS2 is LOW. 3. Address valid prior to or coincident with CS1 and or CS2 transition LOW. 4. OE is LOW. 5. Transition is measured 200mV from steady state voltage. 6.4 5 IDT7198S/L CMOS STATIC RAM 64K (16K x 4-BIT) Added Chip Select and Output Enable Controls MILITARY TEMPERATURE RANGE TIMING WAVEFORM OF READ CYCLE NO. 2(1, 2, 4) tRC ADDRESS tAA tOH DATAOUT PREVIOUS DATA VALID DATA VALID 2985 drw 08 tOH TIMING WAVEFORM OF READ CYCLE NO. 3(1, 3, 4) CS1,2 tACS1, 2 tCLZ1, 2 (5) DATAOUT tPU VCC SUPPLY CURRENT ISB ICC DATA VALID tCHZ1, 2 (5) tPD 2985 drw 09 NOTES: 1. WE is HIGH for Read cycle. 2. Device is continuously selected, CS1 is LOW, CS2 is LOW. 3. Address valid prior to or coincident with CS1 and or CS2 transition LOW. 4. OE is LOW. 5. Transition is measured 200mV from steady state voltage. AC ELECTRICAL CHARACTERISTICS (VCC = 5.0V 10%, All Temperature Ranges) 7198S20 7198L20 Symbol Write Cycle tWC tAW tAS tWP tWR1,2 tWHZ tDW tDH tOW (2) (2) 7198S25 7198L25 7198S35/45 7198L35/45 7198S55 7198L55 7198S70 7198L70 7198S85 7198L85 Parameter Write Cycle Time Address Valid to End-of-Write Address Set-up Time Write Pulse Width Write Recovery Time Write Enable to Output in High-Z Data Valid to End-of-Write Data Hold Time Output Active from End-of-Write Min. Max. Min. Max. Min. 17 17 17 0 17 0 -- 10 0 5 -- -- -- -- -- -- 5/6 -- -- -- 20 20 20 0 20 0 -- 13 0 5 -- -- -- -- -- -- 7 -- -- -- 30/40 25/35 25/35 0 25/35 0 -- 15/20 0 5 Max. Min. Max. Min. Max. Min. Max. Unit -- -- -- -- -- -- -- -- -- 50 50 50 0 50 0 25 0 5 -- -- -- -- -- -- 25 -- -- -- 60 60 60 0 60 0 -- 30 0 5 -- -- -- -- -- -- 30 -- -- -- 75 75 75 0 75 0 -- 35 0 5 -- -- -- -- -- -- 40 -- -- -- ns ns ns ns ns ns ns ns ns ns 2985 tbl 12 tCW1,2(1) Chip Select to End-of-Write 10/15 -- NOTES: 1. Both chip selects must be active low for the device to be selected. 2. This parameter is guaranteed by device characterization but is not production tested. 6.4 6 IDT7198S/L CMOS STATIC RAMS 64K (16K x 4-BIT) Added Chip Select and Output Enable Controls MILITARY TEMPERATURE RANGE TIMING WAVEFORM OF WRITE CYCLE NO. 1 (WE CONTROLLED TIMING)(1, 2, 3, 7) WE tWC ADDRESS OE tAW CS1, 2 tAS WE tWP (7) tWR tWHZ (6) DATAOUT (4) tOW (6) (4) tDW DATAIN tDH DATA VALID 2985 drw 10 TIMING WAVEFORM OF WRITE CYCLE NO. 2 (CS CONTROLLED TIMING)(1) CS tWC ADDRESS tAW CS1, 2 tAS WE tCW tWR tDW DATAIN DATA VALID tDH 2985 drw 11 NOTES: 1. WE, CS1 or CS2 must be HIGH during all address transitions. 2. A write occurs during the overlap (tWP) of a LOW WE, a LOW CS1 and a LOW CS2. 3. tWR is measured from the earlier of CS1, CS2 or WE going HIGH to the end of the write cycle. 4. During this period, the I/O pins are in the output state, and input signals must not be applied. 5. If the CS LOW transition occurs simultaneously with or after the WE LOW transition, outputs remain in the high-impedance state. 6. Transition is measured 200mV from steady state. 7. If OE is LOW during a WE controlled write cycle, the write pulse width must be the larger of tWP or (tWHZ + tDW) to allow the I/O drivers to turn off and data to be placed on the required tDW. If OE is HIGH during a WE controlled write cycle, this requirement does not apply and the write pulse can be as short as the specified tWP. 6.4 7 IDT7198S/L CMOS STATIC RAM 64K (16K x 4-BIT) Added Chip Select and Output Enable Controls MILITARY TEMPERATURE RANGE ORDERING INFORMATION IDT7198 Device Type X Power XX Speed X Package B Process/ Temperature Range B Military (-55C to +125C) Compliant to MIL-STD-883, Class B 300 mil Ceramic DIP (D24-1) Leadless Chip Carrier (L28-2) CERPACK (E24-1) D L E 20 25 35 45 55 70 85 Military Only Military Only Military Only Military Only Military Only Military Only Military Only Speed in nanoseconds S L Standard Power Low Power 2985 drw 12 6.4 8 |
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